| Titre : | Heat transfer : thermal management of electronics |
| Auteurs : | Shabany, Younes, Auteur |
| Type de document : | texte imprimé |
| Editeur : | London ; New York ; Boca Raton : CRC Press, 2010 |
| ISBN/ISSN/EAN : | 978-1-4398-1467-3 |
| Format : | 523 p. / ill. / 24 cm |
| Note générale : | Les solutions des problèmes posés dans ce livre se trouvent dans un manuel à part intitulé : Solutions manual for heat transfer : thermal management of electronics : Cote : 536.24 SHA / Numéro d'inventaire : 052144. - Bibliogr. en fin de chapitres. - Index. |
| Langues : | Français |
| Index. décimale : | 536.24 (Conduction d'un milieu à un autre. Transfert de chaleur. Echange, transmission thermique) |
| Tags : | Electronic apparatus and appliances -- Thermal properties Electronic apparatus and appliances -- Protection Heat sinks (Electronics) Electronic packaging System failures (Engineering) -- Prevention Composants électroniques -- Propriétés thermiques Composants électroniques -- Protection Mise sous boîtier (électronique) Dissipateurs thermiques (électronique) Pannes -- Protection |
| Résumé : |
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.
Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation, compared to similar systems. Since there are more design flexibilities in the earlier stages of product design, it would be productive to keep the thermal design in mind as early as the concept and feasibility phase. The author first provides the basic knowledge necessary to understand and solve simple electronic cooling problems. He then delves into more detail about heat transfer fundamentals to give the reader a deeper understanding of the physics of heat transfer. Next, he describes experimental and numerical techniques and tools that are used in a typical thermal design process. The book concludes with a chapter on some advanced cooling methods. With its comprehensive coverage of thermal design, this book can help all engineers to develop the necessary expertise in thermal management of electronics and move a step closer to being a multidisciplinary engineer. |
| Note de contenu : |
Summary :
1. Energy, energy transfer and heat transfer 2. Principle of conservation of energy 3. Heat transfer mechanisms 4. Thermal resistance network 5. Thermal specification of microelectronic packages 6. Fins and heat sinks 7. Heat conduction equation 8. Fundamentals of convection heat transfer 9. Forced convection heat transfer ; external flows 10. Forced convection heat transfer ; internal flows 11. Natural convection heat transfer 12. Radiation heat transfer 13. Computer simulations and thermal design 14. Experimental techniques and thermal design 15. Advanced cooling technologies |
| ISBN 13 : | 978-1439814673 |
Exemplaires (1)
| Cote | Support | Localisation | Section | Disponibilité | Etat_Exemplaire |
|---|---|---|---|---|---|
| 536.24 SHA | Papier | Bibliothèque Centrale | Physique | Disponible | Consultation sur place |
